We currently have open positions as below.
Please send us your resume to jobs@besang.com
------------------------------------------------------------------------------------
3D CMOS Process and Integration Development Sr. Engineer
Responsible for research, development and improvement of newly developed 3-dimentional
(3D) devices & process technologies for manufacture in a semiconductor wafer facility. The
employee exercises independent judgment in developing methods, techniques, and
evaluation criteria.
-Minimum 3-5 years experience in semiconductor manufacturing related process and device
development role.
-Masters or PhD degree in engineering discipline: Electrical Eng, Materials Sci& Eng, Physics
or related.
-Candidate must be a U.S. citizen, legal resident, or have granted asylum or refugee status
in the U.S.
Essential Duties and Responsibilities:
-Process technology development and implementation in CMOS manufacturing, environment.
-Device level characterization and understanding, examples: CMOS transistors and various
memory devices.
-Possess semiconductor fab skills in process development, integration and reliability.
-Participate in and coordinate experiments toward technology development and yield
enhancement.
-Work with process engineering team, test team, customers to define goals and
manufacturing solutions.
-Define tests and device structures for characterization (TCAD, evaluation).
-Provide support to resolve customer issues, problems and questions.
-Support transfer from development to production for processes variants.
-Support process transfer to world wide fabrication facilities if needed.
---------------------------------------------------------------------------------------------------------------------
Module Process Sr. Engineer
Develop and evaluate new processes modules for 3-dimensional (3D) integrated circuit
technologies. Document and report results to the technology development team.
-Minimum 3-5 years experience in semiconductor FAB process module development with the
demonstrated capabilities of providing novel solutions for new technology development.
-Masters or PhD degree in engineering discipline: Electrical Eng, Materials Sci& Eng, Physics
or related.
-Candidate must be a U.S. citizen, legal resident, or have granted asylum or refugee status
in the U.S.
Essential Duties and Responsibilities:
-Diverse experience in module development in the areas of: Etch, Thin Film, CMP, and
Diffusion
-Ability to integrated modules for creation of advanced physical structures
-Effective communication and presentation skills
-Support process transfer to world wide fabrication facilities if needed.
---------------------------------------------------------------------------------------------------------------------
Director of Business Development
This position is responsible for identifying and tracking major customer needs for BeSang’s
3D IC.
The candidate will work on integrating our TRUE 3D IC technologies and IPs that will be used
to implement 3D IC products. The position needs in-depth knowledge of CMOS products
including CPU, DSP, GPU, SoC, DRAM, NAND, NOR, and SRAM. This position is also responsible
for identifying key ecosystem players to drive business use cases for 3D ICs. The person has
extensive direct customer interface and works closely with BeSang’s field sales and
applications teams to develop and execute comprehensive business plans, and grow the
business through IP license deals.
-Minimum 5 years experience in sales and business development
-In-depth knowledge of semiconductor business and products.
-Candidate must be a U.S. citizen, legal resident, or have granted asylum or refugee status
in the U.S.
Please send us your resume to jobs@besang.com
------------------------------------------------------------------------------------
3D CMOS Process and Integration Development Sr. Engineer
Responsible for research, development and improvement of newly developed 3-dimentional
(3D) devices & process technologies for manufacture in a semiconductor wafer facility. The
employee exercises independent judgment in developing methods, techniques, and
evaluation criteria.
-Minimum 3-5 years experience in semiconductor manufacturing related process and device
development role.
-Masters or PhD degree in engineering discipline: Electrical Eng, Materials Sci& Eng, Physics
or related.
-Candidate must be a U.S. citizen, legal resident, or have granted asylum or refugee status
in the U.S.
Essential Duties and Responsibilities:
-Process technology development and implementation in CMOS manufacturing, environment.
-Device level characterization and understanding, examples: CMOS transistors and various
memory devices.
-Possess semiconductor fab skills in process development, integration and reliability.
-Participate in and coordinate experiments toward technology development and yield
enhancement.
-Work with process engineering team, test team, customers to define goals and
manufacturing solutions.
-Define tests and device structures for characterization (TCAD, evaluation).
-Provide support to resolve customer issues, problems and questions.
-Support transfer from development to production for processes variants.
-Support process transfer to world wide fabrication facilities if needed.
---------------------------------------------------------------------------------------------------------------------
Module Process Sr. Engineer
Develop and evaluate new processes modules for 3-dimensional (3D) integrated circuit
technologies. Document and report results to the technology development team.
-Minimum 3-5 years experience in semiconductor FAB process module development with the
demonstrated capabilities of providing novel solutions for new technology development.
-Masters or PhD degree in engineering discipline: Electrical Eng, Materials Sci& Eng, Physics
or related.
-Candidate must be a U.S. citizen, legal resident, or have granted asylum or refugee status
in the U.S.
Essential Duties and Responsibilities:
-Diverse experience in module development in the areas of: Etch, Thin Film, CMP, and
Diffusion
-Ability to integrated modules for creation of advanced physical structures
-Effective communication and presentation skills
-Support process transfer to world wide fabrication facilities if needed.
---------------------------------------------------------------------------------------------------------------------
Director of Business Development
This position is responsible for identifying and tracking major customer needs for BeSang’s
3D IC.
The candidate will work on integrating our TRUE 3D IC technologies and IPs that will be used
to implement 3D IC products. The position needs in-depth knowledge of CMOS products
including CPU, DSP, GPU, SoC, DRAM, NAND, NOR, and SRAM. This position is also responsible
for identifying key ecosystem players to drive business use cases for 3D ICs. The person has
extensive direct customer interface and works closely with BeSang’s field sales and
applications teams to develop and execute comprehensive business plans, and grow the
business through IP license deals.
-Minimum 5 years experience in sales and business development
-In-depth knowledge of semiconductor business and products.
-Candidate must be a U.S. citizen, legal resident, or have granted asylum or refugee status
in the U.S.
Jobs at BeSang
 |
| |
 |
 | |  | |  | |  | |  |
