|
| BeSang is a pioneer in the design, development, and delivery of unsurpassed TRUE 3-dimensional (3D) integrated circuit (IC) solutions. Our cutting edge 3D IC technologies which enable stacking multiple device layers in a vertical direction and provide ultra low-cost and high-performance solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM, SRAM, Flash, Image Sensor and Solid State Drive applications. BeSang has successfully developed 3D ICs and is providing high-value intellectual properties related to its proprietary TRUE 3D ICs. BeSang is a member of GSA since 2007 and a fabless semiconductor company headquartered in Beaverton, Oregon. |
|
|
|