"With BeSang's 3D IC solution, the industry will no longer need to rely on reducing device dimensions for acheving miniaturization." 

             -  Frost & Sullivan's Technical Insights on Growth Opportunities in the Semiconductor Sector

News

    March, 2010 - 3D IC Architecture and Manufacturing Model for High-Density Memories

     November, 2009 (In Korean) - Interview with BeSang Inc (pdf). 

    October, 2009 - 17 startups joined the EETimes' Silicon 60

    August, 2009 - BeSang Demonstrates Multi-Layer 3D IC Technology

   March, 2009 - Frost & Sullivan tips BeSang as 3-DIC winner

   February, 2009 - EE Times updates list of emerging startups   IMGAE

   November, 2008 (In Chinese) - 3D chip for the inevitable road  IMGAE

   October, 2008 - How 3D is Stacking Up - Disruptive New Process   IMGAE

  October 16, 2008 - As ICs stacks up, cleanliness levels may follow

  October 1, 2008 - 3D Technology enables low-cost, high-performance ICs  IMGAE

  September 16, 2008 - Investing in the Chip Revolution

  August, 2008 - 3D Computer Chip Breakthrough 

  August, 2008 (In Korean) - World First 3D IC  IMGAE

  August, 2008 - Semiconductor Spotlight - 3D ICs  IMGAE

  August 12, 2008 - News Clips: YTN News  KBS News  MBC News

 August 12, 2008 (In Korean) - World First 3D IC  IMAGE 

  August 11, 2008 - First 3-D ICs debut  IMAGE  AUDIO

   September 1, 2007 - Single-chip 3-D technology  IMAGE

 April 18, 2007 (In Korean) - Interview with ET News  IMAGE

  April 18, 2007 (PDF) - Radar Scope - BeSang (pdf)

 January 25, 2007 - IP Start-Up Develops High Density Vertical Flash Memory

 April 7, 2006 - Emerging company finds home, clients at Albany NanoTech  IMAGE

  April 6, 2006 - BeSang, Albany NanoTech devise 3D memory