High density DRAM cell array on top of high-performance logic wafer


100x more eDRAM memories compared to SRAM
10x less standby leakage current compared to SRAM
75% less active power consumption at memory sub-system
It is ultra-fast compared to stand-alone DRAM

3D SUPER-EDRAM WILL CHANGE THE RULE OF THE GAME IN ON-CHIP MEMORY AND THE MEMORY SUB-SYSTEM

Monolithic 3D IC
Opportunities, Challenges, and TRUE 3D IC

Device scaling faces it limitation. No cost advantage could be expected from device scaling any more. So, 3D IC seems the only option for the semiconductor industry. However, it is not possible to implement "Logic IC on top of Logic IC" Instead "memory of top of Logic IC" provides significant cost and performance advantages.