Provided in order to explain 3D Super Memories and their value propositions
SSD VS. HDD - $/GB
SSD and HDD prices are compared. Depending on memory capacity, the price gap between SSD and HDD is very different. SSD becomes favorable at low capacity market and HDD is still dominant in cost competition at high capacity market. However, oversupply of 3D NAND and emerging 3D Super-NAND will drop down SSD price abruptly and reconfigure storage market.
WHY 3D NAND SUPPLY WON'T BE ABLE TO MEET THE CUSTOMER DEMANDS?
Many people perceive the current memory market situation as a temporary imbalance between supply and demand. Or, they expect the market to settle when the manufacturing of 3D NAND flash reaches maturity. So, will there be enough NAND supply next year? I believe 3D NAND Supply Won’t Be Able to meet the customer Demands. Let me elaborate.
WHAT IS WRONG WITH SEMI MANUFACTURING?
Difficulties of semiconductor manufacturing is being out of control. It is painful to keep up with semiconductor manufacturing. So, it is important to adopt 'Platform Technology' for semiconductor manufacturing. It will cut down fab investment by 90% and increase wafer throughput 10 times. Also, time-to-market of new product will be much faster.
SSD VS. HDD
As NAND prices drop down, the competition between SSD and HDD heats up. SSD has grown fast for the past few years and will grow faster as NAND vendors make huge investment on 3D NAND. Oversupply of NAND will bring down the cost of SSD and eventually there is a high chance that SSD will overtake HDD market within a few years. Though, the low cost of SSD cannot be sustainable without ultimate low cost solution of NAND flash memory. Unfortunately, 3D NAND does not have low cost solution yet. Eventually, 3D Super-NAND will provide ultimate low cost solution to SSD.
This tutorial video discusses about 3D XPoint including checking the reality of claims, market opportunity (such as SSD and NVDIMM) for 3D XPoint, and competition for 3D XPoint. It also includes discussions about 3D Super-NOR.
STORAGE CLASS MEMORY
Emerging memories, NVDIMM-P, and NOR-based NVDIMM are compared for SCM. It will take time for emerging memories to close the gap with silicon memories due to material, cell size, and manufacturing cost issues. NVDIMM-P is not for SCM. It is just improved SSD. 3D Super-NOR could change the traditional memory hierarchy with ultra-low cost, non-volatile, and fast access time. Now, the semiconductor industry is changing from planar (i.e. Moore's Law) to novel 3D integration.
WHY 3D SUPER-DRAM?
NAND successfully transformed from planar to 3D. However, DRAM still stays in 2-dimension and faces scaling limitation mainly because of scaling of storage capacitor. 3D Super-DRAM could achieve 400% more die-per-wafer using existing storage capacitor and memory logic circuitry. It is simple and enables ultra-low cost.
MONOLITHIC 3D IC FOR LOGIC
According to ITRS, logic transistor scaling faces limitation at 10nm. No more cost advantage could be expected from further scaling of logic transistor. So, monolithic 3D IC should be inevitable option for logic products. However, technically, it is extremely difficult to implement monolithic 3D logic IC. Moreover, it will be difficult to achieve cost reduction from monolithic 3D Loigc IC if there is no smart way to reduce cost. Therefore, system-level monolithic 3D IC should be considered in order to achieve low cost and high performance.
WHAT IS 3D SUPER-NAND?
it describes 3D Super-NAND including comparison with 3D NAND. Wafer processing, device issues, and memory size expansion capability are also discussed.
3D SUPER-NAND VS. 3D NAND
Gate controlled charge, cell-to-cell interference, gate electric field, and material quality are compared among planar NAND, other 3D NANDs, and 3D Super-NAND. 3D Super-NAND is expected to have about 2-3 times better functionality compared to other 3D NAND, which includes program/erase speed and power consumption. 3D Super-NAND also shows 10x to 100x better reliability compared to other 3D NANDs.
WHAT IS WRONG WITH 3D NAND?
This video tutorial discusses issues with 3D NAND, such as WL staircase, big cell size, limitation of vertical scaling, inefficient product architecture, ROI from fab investment, and high ‘Cost-per-Bit’. As an ultimate low cost solution, 3D Super-NAND has been discussed.
BESANG INC. - 3D SUPER MEMORIES
3D Super Memories are disruptive semiconductor memory technologies provided by BeSang Inc.
DISRUPTIVE MEMORY PLATFORM
BeSang's Super-Memory technologies are discussed.
2017 GSA MEMORY+ CONFERENCE
Sang-Yun Lee, CEO of BeSang Inc. - Panel Discussion regarding "Disruptive Memory Solution for Next 50 Years"