BeSang 3D Super Memories - "The Future of IC Design"
"To celebrate 60 years of EDN, we’re looking into the future to predict what advancements will be made in IC Design in the next 60 years." - EDN
Frost & Sullivan tips BeSang as 3D IC Winner
"It will get freedom to build higher density IC chips by simply adding more layers in 3D directions in a cost-effective manner"
3D IC ARCHITECTURE
Memory business models and device scaling are facing challenges due to high manufacturing costs
LIMITATION OF 3D NAND SCALING
The life span of 3D NAND might be a lot shorter than most people think
TOP 10 NEXT GENERATION STORAGE
True 3D chips layered directly on same die
WILL THE LIFESPAN OF CMOS IC END?
According to ITRS, CMOS IC will no longer be economically desirable for companies to continue traditional transistor miniaturization under 10nm.
3D XPOINT - REALITY
3D XPoint was debuted with big claims in 2015. However, there are many wild guess and speculations because details have not been shared in public domain
WILL SCM DISRUPT MEMORY HIERARCHY?
Will storage class memory come to the market and disrupt traditional memory hierarchy?
WHY 3D SUPER-DRAM?
What is 3D Super-DRAM and why do we need 3D Super-DRAM? The CEO of BeSang makes the case.
WHAT IS WRONG WITH 3D NAND?
3D NAND comes with several technical issues and misunderstandings.
First 3D IC Debut
"The world's first 3D chip process is ready for licensing from the fabless semiconductor design house BeSang Inc."