BeSang 3D Super Memories - "The Future of IC Design"
"To celebrate 60 years of EDN, we’re looking into the future to predict what advancements will be made in IC Design in the next 60 years." - EDN
3D IC ARCHITECTURE
Memory business models and device scaling are facing challenges due to high manufacturing costs
TOP 10 NEXT GENERATION STORAGE
True 3D chips layered directly on same die
3D XPOINT - REALITY
3D XPoint was debuted with big claims in 2015. However, there are many wild guess and speculations because details have not been shared in public domain
WILL SCM DISRUPT MEMORY HIERARCHY?
Will storage class memory come to the market and disrupt traditional memory hierarchy?
WHY 3D SUPER-DRAM?
What is 3D Super-DRAM and why do we need 3D Super-DRAM? The CEO of BeSang makes the case.
WHAT IS WRONG WITH 3D NAND?
3D NAND comes with several technical issues and misunderstandings.