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| BeSang Inc. is a is a fabless semiconductor IP company providing 3-Dimensional Enabling Technology which allows simple & large functional blocks (i.e. memory core or photo diode) to be placed on top of the logic (or periphery logic) layer within a semiconductor device. Unlike conventional 3D package technology, BeSang's 3D Enabling Technology is 'Single Chip' 3D IC technology which provides unlimited interconnections between upper layer and bottom layer using conventional via. BeSang's proprietary 3D technology provides high density memory cell, high quantum efficient image sensor, and 'more die per wafer' solutions. In addition, performance of semiconductor devices (CPU/SoC/Memory) increases sharply with high density embedded memory. BeSang's 3D Enabling Technology is also designed to provide low power, low cost, and high yield solutions. |
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