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"Prior to BeSang's design, all the previous attempts were pseudo 3D IC,"

– Prof. Simon M. Sze


"With BeSang's 3D IC solution, the industry will no longer need to rely on
reducing device dimensions for achieving miniaturization."

-  Frost & Sullivan's Technical Insights on Growth Opportunities
in the Semiconductor Sector
BeSang Sponsorship at 2012 International Memory Workshop
Melia Milano - Milan, Italy - May 20th-23rd, 2012
BeSang Sponsorship at The 10th International System-on-Chip (SoC) Conference
Hilton Irvine, California - Oct. 24th & 25th, 2012
BeSang and SK hynix Sign Patent License Agreement