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| "Prior to BeSang's design, all the previous attempts were pseudo 3D IC," – Prof. Simon M. Sze "With BeSang's 3D IC solution, the industry will no longer need to rely on reducing device dimensions for achieving miniaturization." - Frost & Sullivan's Technical Insights on Growth Opportunities in the Semiconductor Sector |
| BeSang Sponsorship at 2012 International Memory Workshop Melia Milano - Milan, Italy - May 20th-23rd, 2012 |
| BeSang Sponsorship at The 10th International System-on-Chip (SoC) Conference Hilton Irvine, California - Oct. 24th & 25th, 2012 |
