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WHO WE ARE
Having accumulated experience and knowledge in advanced semiconductor memories, we are experts in semiconductor process architecture, device engineering, process engineering, and intellectual properties.
Message from the founder and CEO
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Sang-yun Lee
"BeSang Inc. is the 𝐅𝐈𝐑𝐒𝐓 company which successfully implements 𝐦𝐨𝐧𝐨𝐥𝐢𝐭𝐡𝐢𝐜 𝟑𝐃 𝐈𝐂 in the semiconductor industry, and continuously developing next generation 3D IC memory solutions based on monolithic and hybrid bonding methods.
Our goal is to defy the scaling and application limitations of ultra-high density memory cells for stand-alone and embedded cache products."
3D SUPER-MEMORIES
an introduction
Short video introduction to BeSang's 3D Super Memories
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